Základné dosky

Intel ATX LGA 2066 Workstation motherboard with PCIe 3.0 x16, 14 power stages, triple M.2 with dual M.2 heatsinks, dual U.2, dual Intel LAN, DDR4 ECC memory support, and ASUS Control Center Express Ready for the latest Intel® Xeon® W workstation Processor

AMD WRX80 Ryzen™ Threadripper™ PRO extended-ATX workstation motherboard with Intel dual 10 G LAN, USB 3.2 Gen 2x2 Type-C port, 7 x PCIe 4.0 x16 slots, 3 x M.2 PCIe 4.0, ASMB9-iKVM, 2 x U.2 and 16 power stages AMD sWRX8 socket: Ready for AMD Ryzen™ Threadr

AMD WRX80 Ryzen™ Threadripper™ PRO extended-ATX workstation motherboard with Intel dual 10 G LAN, USB 3.2 Gen 2x2 Type-C port, 7 x PCIe 4.0 x16 slots, 3 x M.2 PCIe 4.0, ASMB9-iKVM, 2 x U.2 and 16 power stages CPU AMD® Ryzen™ Threadripper™ Pro Processors*

Základná doska AMD AM4 X570 ATX pre pracovné stanice s 3 PCIe 4.0 x16, 14 s výkonovými stupnami IR3555, podporou pamäte DDR4 ECC, Intel Gigabit LAN, duálnym M.2, U.2 a ASUS Control Center Express Tri sloty PCIe 4,0 x16 s optimalizovaným usporiadaním trás

CPU Intel® Socket 2066 Processors Supports Intel® 14 nm CPU Supports Intel® Turbo Boost Max Technology 2.0 * The Intel® Turbo Boost Technology 2.0 support depends on the CPU types. Chipset Build in Intel® C422 Memory 8 x DIMM, Max. 512GB, DDR4 2666/2400

Intel® C621 motherboard with quad-strength graphics support and 12 DDR4 memory slots Up to 4-Way NVIDIA® SLI® and AMD® Crossfire X™ on demand Two-way Xeon® CPU OC tuning for extreme performance Superb scalability and connectivity with onboard U.2, M.2, an

Základná doska Intel LGA 2066 ATX s pamätou DDR4 4133MHz, duálnym M.2, chladicom M.2, U.2, a konektormi USB 3.1 Gen 2. 5-Way Optimization: Jednoduché ladenie celého systému poskytuje možnost optimalizácie pretaktovania a inteligentné chladenie pre rôznoro

Intel LGA 1151 ATX motherboard with AI Overclocking, quad-GPU support, DDR4 4266 MHz, Dual M.2, Intel Optane memory ready, SATA 6Gb/s, USB 3.1 Gen 2 Type-C and front-panel connectors Quad-GPU supports: Fits up to four dual-slot graphics cards and supports

Popis produktu: Product SKUs MBD-X10SRi-F -B X10SRi-F (Bulk Pack) Physical Stats Form Factor ATX Dimensions 12" x 9.6", (30.5cm x 24.4cm) Processor CPU Intel® Xeon® processor E5-2600/1600 v3 family (up to 145W TDP **) Single Socket R3 (LGA

Key Features 1. Single AMD EPYC™ 7000-Series Processor 2. 1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs 3. Expansion slots: 3 PCI-E 3.0 x16 3 PCI-E 3.0 x8 4. 8 SATA 3.0 + Broadcom 3008 for 8 SAS3 ports, 1 M.2 5. Dual Gigabit

Key Features 1. Single AMD EPYC™ 7000-Series Processor 2. 1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs 3. Expansion slots: 3 PCI-E 3.0 x16 3 PCI-E 3.0 x8 4. 8 SATA 3.0 + Broadcom 3008 for 8 SAS3 ports + 2 NVMe, 1 M.2 5. Dua

Key Features 1.Single AMD EPYC™ 7002 Series Processor 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Expansion slots: 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.2 M.2, 2 SlimSAS x8

Key Features 1.Single AMD EPYC™ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Expansion slots: 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 M.2 Interface: 2

Key Features 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DD

Key Features Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C621 Chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots Expansion slots: 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E

SUPERMICRO MB 1xLGA1151, iC232,DDR4,6xSATA3,PCIe 3.0 (1 x8, 1 x8 (in x16), 1 x4 (in x8)), IPMI (bulk) CPU/Chipset • Intel Skylake Xeon E3-1200 v5 and 6th Gen Core i3, Pentium, Celeron processors. Skt-H4, LGA1151 • Intel C232 PCH • 4x ECC/non-ECC UDIMM sl

Popis produktu: Product SKUs MBD-X10DRL-i -O X10DRL-i (Standard Retail Pack) MBD-X10DRL-i -B X10DRL-i (Bulk Pack) Physical Stats Form Factor ATX Dimensions 12" x 10" (30.48cm x 25.4cm) Processor/Cache CPU Intel® Xeon® processor E5-2600 v3 fam

Key Features Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Intel® C621 Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots 1 PCI-E 3.0 x32 Left Riser S

Key Features 8th/9th Generation Intel® Core?i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor., Single Socket LGA-1151 (Socket H4) supported, CPU TDP support Up to 95W TDP Intel® C242 chipset Up to 128GB DDR4

Key Features 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP Intel® C621 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB